When SMT placement is completed and the current production plan is converted into another placement plan, it needs to change the line. We need to reprogram each data of the placement machine in time, replace the feeder, adjust the substrate transport organization, positioning table, placement head, etc. Tweaks and changes make thread change operations. Below, Shenzhen Zhichi Technology will share with you the specific operation steps for changing the line of the placement machine.

First of all, the placement system should be reprogrammed. The placement machine system generally adopts two programming methods: manual programming and computer programming. Low-end placement machines usually use manual teaching programming, and high-end placement machines can be fully programmed using computer automation.

Then replace the feeder of the original patch product. In order to reduce the time for the placement machine to replace the feeder, the more common method is to use the "quick release" feeder, and the faster method is to replace the feeder structure, so that the placement machine substrate The feeder for each element on the type is installed on a separate feeder frame for replacement.

Then adjust the transmission mechanism of the placement machine and the positioning table. When the size of the replaced substrate is different from that of the current device, the width of the positioning table of the substrate and the transport mechanism for transporting the substrate should be adjusted. The placement machine can be actively adjusted under program control, and the next-level placement machine can be adjusted manually.

Finally, the placement head of the placement machine is replaced. When the type of components to be mounted on the substrate exceeds the device size of the placement head, perhaps when the substrate type is changed, the placement head of the placement machine is often replaced or adjusted. Most placement machines can automatically perform replacement and adjustment of placement heads under program control, while some placement machines need to perform such operations manually. The phenomenon is that the components are displaced after the adhesive is cured, and the component pins are not on the pads in severe cases. The reason is that the glue output of the patch glue is not uniform, such as one more and one less in the two glues of the chip component; the component is displaced during the patch or the initial adhesion of the patch glue is low; the PCB placement time after dispensing is too long, and the glue is half cured.