PRODUCTS

Product

Home

HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.

Off-Line AOI

▲Economical and practical AOI. ▲High precision detection platform design. ▲Fast programming debugging integration. ▲Automatic recognize the Top and Bottom side. ▲Professional SPC system.

PEMTRON 3D SPI

Using the principle of optics, the height of the solder paste printed on the PCB board is calculated by the method of triangulation

PEMTRON 3D AOI

UV Inspection Conveyor

This is used at end of conformal coating line, it’s designed to frequent visual inspection of PCB’s is required.

Customer Case

Automatic Solder Paste Mixer

The solder paste mixer is a fully automatic way of mixing solder paste. The equipment’s internal motor rotates and turns, which is the mixing concept. The solder paste mixer has several advantages over manual mixing, including the ability to arbitrarily regulate the direction and duration of stirring as well as the unchanging mixing speed.

PCB Loader

Equipped at the start terminal of SMT/DIP line, sensors are provided to prevent platform movement until the board has been fully inserted into the magazine automatically. reducing labor cost, increasing production efficiency.