Product
HELLER Vacuum Reflow Oven
HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.
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Off-Line AOI
▲Economical and practical AOI.
▲High precision detection platform design.
▲Fast programming debugging integration.
▲Automatic recognize the Top and Bottom side.
▲Professional SPC system.
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PEMTRON 3D SPI
Using the principle of optics, the height of the solder paste printed on the PCB board is calculated by the method of triangulation
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UV Inspection Conveyor
This is used at end of conformal coating line, it’s designed to frequent visual inspection of PCB’s is required.
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Automatic Solder Paste Mixer
The solder paste mixer is a fully automatic way of mixing solder paste. The equipment’s internal motor rotates and turns, which is the mixing concept. The solder paste mixer has several advantages over manual mixing, including the ability to arbitrarily regulate the direction and duration of stirring as well as the unchanging mixing speed.
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PCB Loader
Equipped at the start terminal of SMT/DIP line, sensors are provided to prevent platform movement until the board has been fully inserted into the magazine automatically. reducing labor cost, increasing production efficiency.
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FIFO Buffer
This The FIFO buffer is used on SMT or conformal coating line with 2 main functions:
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NG&OK Unloader
TEquipped at the end of SMT and DIP production line, automatically stores NG and OK boards separately by receiving signals from inspection machine. Automatic entry and exit, short cycle time, enhances efficiency and product quality.
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Cooling Buffer
This device combined cooling and storage functions, used to cool the PCB after Reflow Oven in FIFO way.
1.Cooling PCB in FIFO way, avoid aging of AOI camera and conveyor belt. Reducing Thermal expansion and cold contraction, decreasing misjudgment rate of AOI machine.
2.Storage function to mitigate the traffic stress of PCB stack.
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+86 18665891623
Email:Rylee.young@szwit.com
Tel: +86-755-27456080
Company Address: Fuyong street, Bao'an District, Shenzhen
2nd floor, building 11, Huafeng Science Park, Tangwei