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HELLER Vacuum Reflow Oven

HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.

Off-Line AOI

▲Economical and practical AOI. ▲High precision detection platform design. ▲Fast programming debugging integration. ▲Automatic recognize the Top and Bottom side. ▲Professional SPC system.

PEMTRON 3D SPI

Using the principle of optics, the height of the solder paste printed on the PCB board is calculated by the method of triangulation

PEMTRON 3D AOI

UV Inspection Conveyor

This is used at end of conformal coating line, it’s designed to frequent visual inspection of PCB’s is required.

Customer Case

PCB Loader

Equipped at the start terminal of SMT/DIP line, sensors are provided to prevent platform movement until the board has been fully inserted into the magazine automatically. reducing labor cost, increasing production efficiency.

FIFO Buffer

This The FIFO buffer is used on SMT or conformal coating line with 2 main functions:

NG&OK Unloader

TEquipped at the end of SMT and DIP production line, automatically stores NG and OK boards separately by receiving signals from inspection machine. Automatic entry and exit, short cycle time, enhances efficiency and product quality.

PCB cleaning machine

This unit is equipped in front of solder paster or before conformal coating process, The machine uses specially formulated elastomer rollers to remove dust, particles, etc. from the PCB surface. This contamination is transferred from the elastomer rollers to adhesive rolls.

Cooling Buffer

This device combined cooling and storage functions, used to cool the PCB after Reflow Oven in FIFO way. 1.Cooling PCB in FIFO way, avoid aging of AOI camera and conveyor belt. Reducing Thermal expansion and cold contraction, decreasing misjudgment rate of AOI machine. 2.Storage function to mitigate the traffic stress of PCB stack.

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Tel: +86-755-27456080
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2nd floor, building 11, Huafeng Science Park, Tangwei

rylee.young@szwit.com

8618668591623

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+86-18668591623