How to deal with printing offset of solder paste printer?
2022-06-14 10:30
Solder paste printing is the first important process of the SMT process. If the printing offset of the solder paste printer is not dealt with, it is likely to cause batch tin connection, which will affect the quality of the finished product.
How to deal with the printing offset of the solder paste printing machine, Shenzhen Zhichi Technology will share with you here.
Observe the recognition of the MARK point, whether the recognition center will be in the center of the MARK point, the general score is better than 500 or more
Observe the width of the conveyor belt, the track width should not be too wide, otherwise the PCB cannot be clamped.
Observe whether the laser stencil is well fixed and try to push it manually.
The top PIN or BACKUP PIN system, whether the installation is in place, if this happens, you can remove all the top PINs and reinstall them.
Whether the PCB thickness is set properly should be checked first.
Check whether the clamping device of the stencil correction system is normal (this should be confirmed in the self-diagnosis).
Replace the connecting line between the nextmove card and the control box to see if the connection is loose.
Swap the control box with another one, sometimes there is a problem with the slot on the back panel of the control box.
Check whether the bearing in front of the correction motor is worn or defective.
The system software or hard disk is abnormal, reinstall the system or replace the motor.
During the printing process of the solder paste printer, there are often undesirable phenomena such as less tin printing, continuous tin printing, and printing offset, which can be analyzed from the following aspects:
Reasons for less tin printing: insufficient stirring of solder paste, high viscosity, too fast scraper speed, and clogging of stencil holes.
Reasons for continuous tin printing: excessive stirring of the solder paste, low viscosity, excessive pressure on the stencil or scraper, and the printed base is not properly set, resulting in uneven placement of the PCB.
Reasons for printing offset: the stencil is not adjusted, the stencil does not match the PCB pad, and the pressure of the stencil or the squeegee is too large.
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