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HELLER Vacuum Reflow Oven
HELLER Vacuum Reflow Oven
HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.
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HELLER Reflow Oven MK5 Series
HELLER Reflow Oven MK5 Series
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HELLER Reflow Oven MK7 Series
HELLER Reflow Oven MK7 Series
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IC chips Curing Oven
IC chips Curing Oven
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process
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UV curing equipment
UV curing equipment
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Infrared curing oven
Infrared curing oven
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On-line UV (LED) curing oven
On-line UV (LED) curing oven
Online UV (LED) curing oven is suitable for TFT screen, IPS screen, superLCD screen, OlED screen glue curing.
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