Product
IC chips Curing Oven
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process
View More
On-line UV (LED) curing oven
Online UV (LED) curing oven is suitable for TFT screen, IPS screen, superLCD screen, OlED screen glue curing.
View More
HELLER Vacuum Reflow Oven
HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.
View More
Follow Us
Scan to follow the official account
Service Hotline
+86 18668591623
Email:songxinhui@szwit.com
Tel: +86-755-27456080
Company Address: Fuyong street, Bao'an District, Shenzhen
2nd floor, building 11, Huafeng Science Park, Tangwei