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HELLER Vacuum Reflow Oven
HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.
Features:
Heller Industries provides optimized cycle (average 30s~60s) to achieve super high UPH.
Heller vacuum assisted reflow applies multi-zones to meet various thermal profile requirements.
Heller Industries utilizes advanced pumping package with high capacity for fast pump down time.
Reflow time under vacuum of 15 seconds was able to achieve <1% total void area spec.
Heller adopts high efficient flux collection system to collect the flux and keep tunnel clean.
On-the-fly maintenance is available.
Chamber exhaust foreline, ball valve, butterfly valve and dry vacuum pump are heated to 150℃ to eliminate flux condensation.
Specification:
Models |
1826MK5 |
1936MK5 |
Dimensions |
L4650×W1500×H1640(mm) |
L589×W1500×H16400(mm) |
Power Supply |
380 VAC Option: 208/240/400/415/480 VAC |
380 VAC Option: 208/240/400/415/480 VAC |
Process Gasses |
N2 Option: Formic Acid |
N2 Option: Formic Acid |
Heating Zones |
Convection Heating Top 8 + Bottom 6 |
Convection Heating Top 10 + Bottom 8 |
Cooling Zones |
2 Option: Bottom |
3 Top Option: Bottom |
Min. Vacuum Level |
Standard: < 10 Torr Option: 1 Torr |
Standard: <10 Torr Option: 1 Torr |
Max. Working Temperature |
Standard: 350℃ Option: 400℃ /450℃ |
Standard: 350℃ Option: 400℃ /450℃ |
Max. Product Height |
35mm Option: 60 mm |
35mm Option: 60 mm |
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