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HELLER Vacuum Reflow Oven


HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.


  • Description
    • Commodity name: HELLER Vacuum Reflow Oven
    • Commodity ID: 501

    HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.

    HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.

    Features:
    Heller Industries provides optimized cycle (average 30s~60s) to achieve super high UPH.
    Heller vacuum assisted reflow applies multi-zones to meet various thermal profile requirements.
    Heller Industries utilizes advanced pumping package with high capacity for fast pump down time.
    Reflow time under vacuum of 15 seconds was able to achieve <1% total void area spec.
    Heller adopts high efficient flux collection system to collect the flux and keep tunnel clean.
    On-the-fly maintenance is available.
    Chamber exhaust foreline, ball valve, butterfly valve and dry vacuum pump are heated to 150℃ to eliminate flux condensation.

    Specification:

    Model

    1808MK5-VR

    1911MK5-VR

    1912MK5-VR

    1936MK5-VR

    2043MK5-VR

    Oven Length

    465cm

    590cm

    590cm

    589cm

    680cm

    Process Gas Options

    Air, Nitrogen, Formic Acid, forming gas

    Air, Nitrogen, Formic Acid, forming gas

    Air, Nitrogen, Formic Acid, forming gas

    Air, Nitrogen, Formic Acid, forming gas

    Air, Nitrogen, Formic Acid, forming gas

    Heated Zones

    Convection: 7 Top / 7 Bottom IR: 3 Top

    Convection:  10Top / 10 Bottom IR: 3 Top

    Convection: 11 Top / 11 Bottom IR: 3 Top

    Convection:  8Top / 8 Bottom IR: 3 Top

    Convection:  10Top / 10 Bottom IR: 3 Top

    Heated Length (Convection/Total)

    174cm / 273cm

    262cm / 364cm

    290cm / 382cm

    290cm / 382cm

    327cm / 430cm

    Cool Zones

    2 Top (Bottom Option)

    3 Top (Bottom Option)

    3 Top (Bottom Option)

    3 Top (Bottom Option)

    3 Top (Bottom Option)

    Max Working Temperature (Convection / IR)

    Standard: 350°C / 400°C, Option: 400°C / 480°C

    Standard: 350°C / 400°C, Option: 400°C / 480°C

    Standard: 350°C / 400°C, Option: 400°C / 480°C

    Standard: 350°C / 400°C, Option: 400°C / 480°C

    Standard: 350°C / 400°C, Option: 400°C / 480°C

    Min Vacuum

    Standard: 10 Torr Option: < 10 Torr

    Standard: 10 Torr Option: < 10 Torr

    Standard: 10 Torr Option: < 10 Torr

    Standard: 10 Torr Option: < 10 Torr

    Standard: 10 Torr Option: < 10 Torr

    Max Board Size

    L500 x W450 x H29cm

    L500 x W450 x H29cm

    L350 x W350 x H29cm

    L350 x W350 x H29cm

    L500 x W450 x H29cm

    Cleanroom Option

    Down to Class 1000

    Down to Class 1000

    Cleanroom Option

    Down to Class 1000

    Cleanroom Option

    Key words:
    • Reflow oven
    • Vacuum Assisted Reflow oven
    • HELLER Reflow oven

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