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IC chips Curing Oven

It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process
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IC Curing Oven
Chip Curing Oven
Consultation telephone:0755-27456080
Product description
Parameters

Function:
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. The smart IC card tape is mainly used for the SIM card contact module, the social security card contact module, the financial card contact module and the like.
Adopting the display control touch screen plus Siemens PLC precise temperature control, the three sections have a total temperature control of 24 zones, the transmission motor adopts stepper motor, the transportation is stable, and the software comes with temperature curve test. 

Specification:

Dimensions(L×W×H)

3600×974×1205(mm)

Weight

Approx.600kg

Transport Height

900±20mm

Transport speed

0-2000mm/min

Transport direction

L→R(R→L)

Transmission motor power

57#stepper motor DC4.2A

PCB Width

36mm

Heating pipe qty.:

Upper layer 24 ,lower layer 24

Temp. zone qty.

3 sections of 24 temperature zones

Cover opening method

Pneumatic lifting

Heating plate type

Ceramic infrared heating plate

Temp. adjustment range

Room Temp.—220℃

Heating Arising time

8-10MIN

PCB board size

Tape type IC chip tape

Control Method

Touch Screen

Power supply

3-phase 4-wire system AC380V 50/60Hz

Total power

12KW

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Service hotline:

Email:rylee.young@szwit.com
Fax:0755-27456080
Add:Fuyong street, Bao'an District, Shenzhen
2nd floor, building 11, Huafeng Science Park, Tangwei

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