Products
IC chips Curing Oven
Function:
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. The smart IC card tape is mainly used for the SIM card contact module, the social security card contact module, the financial card contact module and the like.
Adopting the display control touch screen plus Siemens PLC precise temperature control, the three sections have a total temperature control of 24 zones, the transmission motor adopts stepper motor, the transportation is stable, and the software comes with temperature curve test.
Specification:
|
Dimensions（L×W×H） |
3600×974×1205(mm) |
|
Weight |
Approx.600kg |
|
Transport Height |
900±20mm |
|
Transport speed |
0-2000mm/min |
|
Transport direction |
L→R（R→L） |
|
Transmission motor power |
57#stepper motor DC4.2A |
|
PCB Width |
36mm |
|
Heating pipe qty.: |
Upper layer 24 ，lower layer 24 |
|
Temp. zone qty. |
3 sections of 24 temperature zones |
|
Cover opening method |
Pneumatic lifting |
|
Heating plate type |
Ceramic infrared heating plate |
|
Temp. adjustment range |
Room Temp.—220℃ |
|
Heating Arising time |
8-10MIN |
|
PCB board size |
Tape type IC chip tape |
|
Control Method |
Touch Screen |
|
Power supply |
3-phase 4-wire system AC380V 50/60Hz |
|
Total power |
12KW |
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Service hotline:
Email：rylee.young@szwit.com
Fax：0755-27456080
Add：Fuyong street, Bao'an District, Shenzhen
2nd floor, building 11, Huafeng Science Park, Tangwei
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