IC chips Curing Oven

It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process

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Product serial number

504

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IC Curing Oven

Chip Curing Oven

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Product description

Parameters

Function:
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. The smart IC card tape is mainly used for the SIM card contact module, the social security card contact module, the financial card contact module and the like.
Adopting the display control touch screen plus Siemens PLC precise temperature control, the three sections have a total temperature control of 24 zones, the transmission motor adopts stepper motor, the transportation is stable, and the software comes with temperature curve test.

Specification:

Dimensions（L×W×H）	3600×974×1205(mm)
Weight	Approx.600kg
Transport Height	900±20mm
Transport speed	0-2000mm/min
Transport direction	L→R（R→L）
Transmission motor power	57#stepper motor DC4.2A
PCB Width	36mm
Heating pipe qty.:	Upper layer 24 ，lower layer 24
Temp. zone qty.	3 sections of 24 temperature zones
Cover opening method	Pneumatic lifting
Heating plate type	Ceramic infrared heating plate
Temp. adjustment range	Room Temp.—220℃
Heating Arising time	8-10MIN
PCB board size	Tape type IC chip tape
Control Method	Touch Screen
Power supply	3-phase 4-wire system AC380V 50/60Hz
Total power	12KW