Product
IC chips Curing Oven
Classification:
- Description
-
- Commodity name: IC chips Curing Oven
- Commodity ID: 504
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process
Function:
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. The smart IC card tape is mainly used for the SIM card contact module, the social security card contact module, the financial card contact module and the like.
Adopting the display control touch screen plus Siemens PLC precise temperature control, the three sections have a total temperature control of 24 zones, the transmission motor adopts stepper motor, the transportation is stable, and the software comes with temperature curve test.Specification:
Dimensions（L×W×H）
3600×974×1205(mm)
Weight
Approx.600kg
Transport Height
900±20mm
Transport speed
0-2000mm/min
Transport direction
L→R（R→L）
Transmission motor power
57#stepper motor DC4.2A
PCB Width
36mm
Heating pipe qty.:
Upper layer 24 ，lower layer 24
Temp. zone qty.
3 sections of 24 temperature zones
Cover opening method
Pneumatic lifting
Heating plate type
Ceramic infrared heating plate
Temp. adjustment range
Room Temp.—220℃
Heating Arising time
8-10MIN
PCB board size
Tape type IC chip tape
Control Method
Touch Screen
Power supply
3-phase 4-wire system AC380V 50/60Hz
Total power
12KW
Key words:- IC Curing Oven
- Chip Curing Oven
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