Product
IC chips Curing Oven
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process
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On-line UV (LED) curing oven
Online UV (LED) curing oven is suitable for TFT screen, IPS screen, superLCD screen, OlED screen glue curing.
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HELLER Vacuum Reflow Oven
HELLER Industries has developed a vacuum module that inserts directly in its reflow oven line to meet new rising demand of high volume, void-free, automated inline soldering. Vacuum module can be inserted in zone directly after reflow peak (liquidus) has occurred or an IR Panel can be added to the chamber to reach reflow peak under vacuum. Convection reflow with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications to achieve low COO and high UPH.
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Off-Line AOI
▲Economical and practical AOI.
▲High precision detection platform design.
▲Fast programming debugging integration.
▲Automatic recognize the Top and Bottom side.
▲Professional SPC system.
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PEMTRON 3D SPI
Using the principle of optics, the height of the solder paste printed on the PCB board is calculated by the method of triangulation
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Email:songxinhui@szwit.com
Tel: +86-755-27456080
Company Address: Fuyong street, Bao'an District, Shenzhen
2nd floor, building 11, Huafeng Science Park, Tangwei