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Cooling Buffer


This device combined cooling and storage functions, used to cool the PCB after Reflow Oven in FIFO way. 1.Cooling PCB in FIFO way, avoid aging of AOI camera and conveyor belt. Reducing Thermal expansion and cold contraction, decreasing misjudgment rate of AOI machine. 2.Storage function to mitigate the traffic stress of PCB stack.


  • Description
    • Commodity name: Cooling Buffer
    • Commodity ID: 409

    This device combined cooling and storage functions, used to cool the PCB after Reflow Oven in FIFO way. 1.Cooling PCB in FIFO way, avoid aging of AOI camera and conveyor belt. Reducing Thermal expansion and cold contraction, decreasing misjudgment rate of AOI machine. 2.Storage function to mitigate the traffic stress of PCB stack.

    Function:

    This device combined cooling and storage functions, used to cool the PCB after Reflow Oven in FIFO way. 
    1.Cooling PCB in FIFO way, avoid aging of AOI camera and conveyor belt. Reducing Thermal expansion and cold contraction, decreasing misjudgment rate of AOI machine.
    2.Storage function to mitigate the traffic stress of PCB stack

    Features:

    1. Full steel structure, welded with metal plate and high temperature spray coated for the outer surface.
    2.Mitsubishi PLC control system, touch screen interface 
    3.The cooling area is equipped with cooling fans, cooling time can be set manually.
    4. Storage board in FIFO way
    5.The feeding part can adjust width automatically, precision ball screw transmission, which is smooth and stable.
    6. PCB magazine is made of pure aluminum, with a louver shape, smooth airflow, and fast cooling.
    7.The lifting of the magazine adopts a Mitsubishi servo, with accurate and stable stopping. Precision ball screw and hardened chrome plated rod.
    8. Adopt a background simulation photoelectric sensor, suitable for various color PCBs with sensitive induction.
    9. Configure with Standard SMEMA to communicate with other machines to achieve inline operation
    10. CE certified.

    Specification:

    Model

    WIT-PCB-C20Single

    WIT-C250-DDual rail

    Overall dimensionL×W×H

    1260×847×1489(mm)

    980×1236×1430(mm)

    PCB size L×W

    50×50~550×460 (mm)

    50×50~330×300(mm)

    Power supply

    AC220V 50/60HZ

    Air Pressure

    5~6KGf/cm²

    Power

    1000W

    2000W

    Operating height

    900±30(mm)

    Transmission speed

    1-12m/Min

    PCB thickness

    0.6-4mm thick

    PCB storage capacity

    20PCS

    40PCS

    Storage height

    23mm

    Transport direction

    L-R or R-L (optional)

    Control Mode

    PLC+ Touch Screen

    Key words:
    • Buffer Machine
    • NG Buffer
    • Cooling Buffer Machine

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