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Selective wave soldering machine


Selective soldering is a special type of wave soldering developed to meet the through-hole components. The general standard configuration of selective soldering consists of three modules: flux spraying, preheating and soldering.Through the equipment programming device, the flux spraying module can finish selective spraying of flux for each soldering point in turn. After preheating, the soldering module will complete soldering point by point.


  • Description
    • Commodity name: Selective wave soldering machine
    • Commodity ID: 601

    Selective soldering is a special type of wave soldering developed to meet the through-hole components. The general standard configuration of selective soldering consists of three modules: flux spraying, preheating and soldering.Through the equipment programming device, the flux spraying module can finish selective spraying of flux for each soldering point in turn. After preheating, the soldering module will complete soldering point by point.

    Selective wave soldering machine

    Selective soldering is a special type of wave soldering developed to meet the through-hole components. The general standard configuration of selective soldering consists of three modules: flux spraying, preheating and soldering.Through the equipment programming device, the flux spraying module can finish selective spraying of flux for each soldering point in turn. After preheating, the soldering module will complete soldering point by point.

    Specification:

    Equipment sizeL×W×H

    2600×1800×1650(mm)

    Equipment weight

    1800kg

    PCB positioning mode

    mechanical positioning

    Work Piece

    MinimumPCBsize (including fixture)

    L120mm W60mm

    MaximumPCBsize (including fixture)

    L508mm W458mm

    PCBthickness

    0.5~6mm

    PCB weight

    Max. 5KG

    PCB up component height

    Max. 100mm

    PCB down component height

    Max. 50mm

    PCB technology edg

    4mm

    PCB Pin spacing

    ≥0.8mm

    Distance between soldering pad and components

    ≥1mm

    PCB ransport belt height

    900±20mm

    PCB transport speed

    0.2~10 m/min

    PCB transport Angle

    PCB transportation direction

    L-R

    transport model

    Monorail and section transport

    Width adjustment range

    60~450 mm

    Adjustable width precision

    ±0.2mm

    Adjustable wide way

    Each module automatically independent/unified adjust

    Fluxer Spray

    Movement form

    PCB board does not move, XY platform moving

    Flux capacity

    2L

    Type of flux

    Wash free/water base

    Flux low level detection

    Low level automatic alarm

    Number of spray heads

    Single nozzleOptional double sprinkler head

    Spray driven mode

    High frequency solenoid valve

    Spray type

    Point spray/line spray

    Nozzle size of spray nozzle

    130umCan match according to the demand

    Spray range

    3-8mm

    Spray working pressure

    0.05Mpa~0.1MPa

    Continuous spray rate

    0~20mm/s

    Moving speed

    0~400mm/s

    Positioning accuracy

    ±0.25mm

    Effective preheating area

    L500mm×W450mm

    bottom sidebottom preheating

    Preheating temperature

     room temperature250℃

    Temperature control accuracy

    ±15

    temperature control mode

    Closed loop control + power control

    Heating mode

    Infrared preheating, infrared radiation

    Heating power

    12KW (1.5KWX8)

    top sidetop preheating

    Preheating temperature

     room temperature250℃

    Temperature control accuracy

    ±15

    temperature control mode

    Closed loop control + power control

    Heating mode

    Hot air preheating, hot air backflow

    Heating power

    6KW

    bottom side

    PCB positioning mode

    mechanical positioning

    Movement form

    PCB board not moving, XYZ platform moving

    Mechanical pump tin furnace

    single tin furnaceOptional double tin furnace

    Double tin furnace spacing

    Min:120mm; Max:225

    Double tinfurnace motion form

    Synchronous operation

    Tin furnace capacity

    8KG/tin stove

    Tin furnace liquid level detection

    Automatic detection of high and low tin level

    Tin wave driven

    Motor driveOptionalelectromagnetic drive

    Tin stove temperature

    room temperature300

    Temperature control accuracy

    ±2

    Heating power

    1.6 KW/tin stove

    Tin wave height

    3~5mm

    Moving andpositioning speed

    Max. 400mm/s

    stroke/speed of tin furnace

    50 mm 100mm/S

    Standard tin nozzle specifications

    φ3~10mm(内径)Non- standard customization is acceptable

    The tin time

    40min/(300)

    Soldering precision

    ±0.25mm

    Welding precision

    The diameter of tin

    Wire 2mmmax.4kg

    Peak height detection

    Fixed probe

    Process visualization

    CCDvisual

    Oxidation rate of solder pot

    In thecase of nitrogen 1.5 m3/ h, theoxidation amount is 0.12kg/8hTin stove

    operating system

    Windows

    Software language

    Chinese and English can be switched

    programmatically

    Online programming, offline programming

    Data import

    Gerber, image import

    Powersupply (three-phasefive-wire)

    3P5W,380VAC,50/60Hz 52A,35KW

    Compressed air pressure

    0.5Mpa

    Compressed air pressure detection

    Low pressure automatic alarm

    Compressed air consumption

    0.014m3/h

    N2 pressure

    0.5Mpa0.8Mpa

    N2 pressure detection

    ow pressure automatic alarm

    N2 purity

    99.999%

    N2 consumption

    1.5m3/h1.8m3/h/ tin stove

    Exhaust air

    360m3/h

    Exhaust pipe diameter

    φ150mm2个)

    Key words:
    • Wave soldering machine
    • Selective wave soldering machine

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